ThermechDIC: Thermo-Mechanical Testing of Electronic Components for CTE, Warpage, and Strain


The ThermechDIC is a complete system used for optical, non-contact, thermal testing of electronic components which include, but are not limited to:

  • Ball grid arrays (BGAs) packaging
  • Flip-chip-packaging
  • Printed circuit boards (PCBs)
  • Solid-state drives (SSDs).

The system allows for accurate (sub-micron), full-field, 3D- contour (shape), displacement, and strain measurement for the determination of the Coefficient of Thermal Expansion (CTE), warpage, and strain measured under a thermal (or cooling) load.

Measurement results are used for evaluation of the thermal mismatch (CTE) within components. Additionally, they are used for warpage analysis, which can be used for FEA validation. DIC is a technique that can process information online, in real-time, allowing data to be acquired, evaluated, and visualized within seconds (during the measurement).


  • Welcome & Introduction
  • Overview of Dantec Dynamics & Solid Mechanics Portfolio
  • Introduction to Digital Image Correlation (DIC)
  • Application Examples of CTE, Warpage, and Strain Measurement
  • Introduction to the ThermechDIC system
  • Advantages of DIC
  • Features of the ThermechDIC system & Istra4D
  • Q&A Session
  • Conclusion

REGISTER here by following the links:

Morning Session (5th of June, 2024 from 0830-1000 CET)


Afternoon Session (5th of June, 2024 from 1530-1700 CET)

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